AVP/RVP
AVP/RVP

The AVP/RVP vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation and LPCVD applications.
Superior process results
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Thermal control from 100 to >1200°C
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Advanced injector technology for optimal gas distribution
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Low O2 load lock maintains controlled wafer environment and ensures repeatability
Low cost of ownership
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Single or dual-boat configuration
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in processtime
System flexibility
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Run 2 wafer sizes simultaneously with no hardware changes
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Compatible with perforated, bonded and ultra-thin substrates
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Field conversion kits enable fast applications changes
For further information on the AVP/RVP, please contact sales@sptmicro.com.