The AVP/RVP vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation and LPCVD applications.

Superior process results

  • Thermal control from 100 to >1200°C

  • Advanced injector technology for optimal gas distribution

  • Low O2 load lock maintains controlled wafer environment and ensures repeatability

Low cost of ownership

  • Single or dual-boat configuration

  • Dual-boat configuration eliminates wafer load/unload time

  • In-situ clean capability reduces CoO by up to 50%

  • Fast temperature ramp/cool option enables up to 30% reduction in processtime

System flexibility

  • Run 2 wafer sizes simultaneously with no hardware changes

  • Compatible with perforated, bonded and ultra-thin substrates

  • Field conversion kits enable fast applications changes

For further information on the AVP/RVP, please contact sales@sptmicro.com.