RVP-300
RVP-300

The RVP-300 vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.
Process Flexibility
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Run 200 and 300 mm simultaneously with no hardware changes
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Compatible with bonded, thin and bowed substrates
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Modular hardware enables rapid system conversion for specific applications
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Advanced across-flow chamber design for enhanced process control
Low Cost of Ownership
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Dual-boat configuration eliminates wafer load/unload time
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In-situ clean capability reduces CoO by up to 50%
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Fast temperature ramp/cool option enables up to 30% reduction in process time
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Factory certified remanufactured systems available
For further information on the RVP-300, please contact sales@sptmicro.com.