The RVP-300 vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.

Process Flexibility

  • Run 200 and 300 mm simultaneously with no hardware changes

  • Compatible with bonded, thin and bowed substrates

  • Modular hardware enables rapid system conversion for specific applications

  • Advanced across-flow chamber design for enhanced process control

Low Cost of Ownership

  • Dual-boat configuration eliminates wafer load/unload time

  • In-situ clean capability reduces CoO by up to 50%

  • Fast temperature ramp/cool option enables up to 30% reduction in process time

  • Factory certified remanufactured systems available


For further information on the RVP-300, please contact sales@sptmicro.com.