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RVP Ace

RVP Ace

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SPT Microtechnologies USA, Inc. (SPT) is a leading vertical batch furnace supplier for innovative MEMS, Power, LED, Semiconductor, III-V, RFID, and packaging device manufacturers.

https://www.sptmicro.com/

RVP Ace

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RVP Ace

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Process Flexibility

  • Run 200 and 300 mm simultaneously with no hardware changes
  • Compatible with bonded, thin and bowed substrates
  • Advanced across-flow chamber design for enhanced process control Low
  • Uses qualified process modules

Low Cost of Ownership

  • Modular architecture for fast move in and startup
  • Improved automation reliability
  • Off-the shelf components
  • Minimum calibration and Preventive maintenance
  • Dual-boat configuration eliminates wafer load/unload time
  • In-situ clean capability reduces CoO by up to 50%
  • Fast temperature ramp/cool option enables up to 30% reduction in process time
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Newest release Rapid Vertical Processor for 200mm and 300mm wafers

The RVP Ace vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers. The RVP Ace improves upon previous version process modules and integrates with updated control architecture. This tool improves upon your specific engineering requirements.

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Applications

  • Wet/dry thermal oxide
  • Radical oxidation
  • Silicon Nitride (Stoichiometric and low stress)
  • TEOS, SiH4 and DCS-based SiO2
  • Doped (P, As, B) and un-doped polysilicon
  • Atomic Layer Deposition
  • Anneal and Cure : 100 to >1200°C
  • ONO and ALD Al2O3
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